variable speed drives
This document communicates a summary of the processes, procedures & quality assurance that are in place for the manufacturing of the Altivar 312. Altivar 312 drives are produced in ISO certified facilities. Customers can be assured that these processes and procedures are followed. Audits conducted by third party representatives verify documented processes and procedures are followed and provide certification to ISO 14001. Schneider Electric utilizes quality assurance processes and procedures to verify the integrity of components and the assembly process. Data is gathered on each unit and tracked via the unique serial number of each unit during the manufacturing process. The document was not intended to imply this data is available in a format that could be easily communicated externally nor that a written report is generated for each product.
Outline of Test Process and Procedures
Printed circuit board testing, dielectric testing, preliminary memory and functional test, unit operation with burn-in testing, and final verification testing are conducted at various points in the manufacturing process for each drive. All aspects of these tests during the assembly are logged electronically for internal tracking purposes. Each unit is checked and product conformance status is recorded at each test station. Appropriate conformance information is carried in nonvolatile memory within the unit. The sequence of testing is monitored. Each test station requires a successful bar code scan on entry to ensure each drives has successfully completed any prerequisite test stations. In addition to the processes and procedures detailed below, each test station has a visual quality inspection check list. This check list includes a physical inspection for proper connections, power component polarities, proper assembly torques, mechanical integrity and proper documentation.
Printed Circuit Board Testing
Printed circuit boards used in the assembly of the ATV312 undergo testing as a part of the board assembly. These tests include: In-circuit, component level testing Functional power-on testing Thermal-cycle stress testing High-potential test applied to high voltage boards
Dielectric Testing (Hi Pot Test)
This test verifies the dielectric withstand between customer connection points and ground to validate that the required isolation barriers are intact. Isolation barriers are typically tested for a duration of one (1) second during which a high voltage is applied according to lEC 61800-5-1 standard. This station is also used to verify placement of the power circuit connections.
Preliminary memory and functional testing
During this test, the unit's on-board communication port is utilized to read internal memory and set aside a portion of memory to track the processes preformed on the drive and its main components. Each tracked process must have been completed successfully to proceed. These include: Supplier preformed tests of printed circuit boards with on-board memory. Successful drive hi-pot test. A preliminary test is run to verify: Heatsink ground screw presence RFI filter jumper setting DC bus Jumper presence EEPROM test Product rating verification Initial rating verification Analog input calibration Analog output calibration Self test (verification of the display board and control terminal board) Pre-motor testPrevious Page